IDT79RV5000250BS272

Factory Authorized Line

INTEGRATED DEVICE TECHNOLOGY

Electronic Component

IDT79RV5000250BS272

LBGA
Call for availability INTEGRATED DEVICE TECHNOLOGY
Mfr Part # IDT79RV5000250BS272
Qty in Stock Call for availability
Factory Stock N/A
Minimum Order 1
Packaging PACKAGE BODY MATERIAL:  PLASTIC/EPOXYPACKAGE CODE:  LBGAPACKAGE DESCRIPTION:  LBGA,PACKAGE SHAPE:  SQUAREPACKAGE STYLE:  GRID ARRAY, LOW PROFILEPART PACKAGE CODE:  BGA
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Availability

  • Qty in StockCall for availability
  • Min. Order Qty1
Specification

ADDRESS BUS WIDTH:  64

BIT SIZE:  64

BOUNDARY SCAN:  YES

CLOCK FREQUENCY-MAX:  125 MHZ

EXTERNAL DATA BUS WIDTH:  64

FORMAT:  FLOATING POINT

INTEGRATED CACHE:  YES

JESD-30 CODE:  S-PBGA-B272

JESD-609 CODE:  E0

LENGTH:  29 MM

LOW POWER MODE:  YES

MANUFACTURER:  INTEGRATED DEVICE TECHNOLOGY INC

MANUFACTURER PART NUMBER:  IDT79RV5000250BS272

NUMBER OF TERMINALS:  272

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LBGA

PACKAGE DESCRIPTION:  LBGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE

PART PACKAGE CODE:  BGA

PIN COUNT:  272

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.65 MM

SPEED:  250 MHZ

SUPPLY VOLTAGE-MAX:  3.465 V

SUPPLY VOLTAGE-MIN:  3.135 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  OTHER

TERMINAL FINISH:  TIN LEAD

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

WIDTH:  29 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR, RISC