BIT SIZE:  64

JESD-30 CODE:  S-PBGA-B304

JESD-609 CODE:  E0

MANUFACTURER:  MICROSEMI STORAGE OTN AND NETWORKING SOLUTIONS

MANUFACTURER PART NUMBER:  RM5271-266S

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF TERMINALS:  304

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA, BGA304,23X23,50

PACKAGE EQUIVALENCE CODE:  BGA304,23X23,50

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

POWER SUPPLIES:  2.5,3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SPEED:  266 MHZ

SUBCATEGORY:  MICROPROCESSORS

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR, RISC