ADDITIONAL FEATURE:  ALSO OPERATES AT 3.3 V; 216-PIN EXPOSEDPAD PACKAGE

BIT SIZE:  64

BOUNDARY SCAN:  NO

FORMAT:  FLOATING POINT

INTEGRATED CACHE:  YES

JESD-30 CODE:  S-PBGA-B256

LOW POWER MODE:  YES

MANUFACTURER:  MICROSEMI STORAGE OTN AND NETWORKING SOLUTIONS

MANUFACTURER PART NUMBER:  RM7065C-600T-D004T

MOISTURE SENSITIVITY LEVEL:  NOT SPECIFIED

NUMBER OF TERMINALS:  256

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  256

SPEED:  600 MHZ

SUPPLY VOLTAGE-NOM:  2.5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TERMINAL FINISH:  NOT SPECIFIED

TERMINAL FORM:  BALL

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR, RISC