Mfr Part #
MC14411P
Qty in Stock
Call for availability
Factory Stock
N/A
Minimum Order
1
Packaging
PACKAGE BODY MATERIAL: PLASTIC/EPOXYPACKAGE CODE: DIPPACKAGE DESCRIPTION: DIP, DIP24,.6PACKAGE EQUIVALENCE CODE: DIP24,.6PACKAGE SHAPE: RECTANGULARPACKAGE STYLE: IN-LINE
Availability
- Qty in StockCall for availability
- Min. Order Qty1
Specification
JESD-30 CODE: R-PDIP-T24
JESD-609 CODE: E0
MANUFACTURER: MOTOROLA SEMICONDUCTOR PRODUCTS
MANUFACTURER PART NUMBER: MC14411P
NUMBER OF TERMINALS: 24
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: DIP
PACKAGE DESCRIPTION: DIP, DIP24,.6
PACKAGE EQUIVALENCE CODE: DIP24,.6
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: IN-LINE
QUALIFICATION STATUS: NOT QUALIFIED
SUBCATEGORY: OTHER MICROPROCESSOR ICS
SURFACE MOUNT: NO
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: TIN/LEAD (SN/PB)
TERMINAL FORM: THROUGH-HOLE
TERMINAL PITCH: 2.54 MM
TERMINAL POSITION: DUAL


