Mfr Part #
MC68EC030FE25B
Qty in Stock
Call for availability
Factory Stock
N/A
Minimum Order
1
Packaging
PACKAGE BODY MATERIAL: CERAMICPACKAGE CODE: QFPPACKAGE DESCRIPTION: QFP, QFP(UNSPEC)PACKAGE EQUIVALENCE CODE: QFP(UNSPEC)PACKAGE STYLE: FLATPACK
Availability
- Qty in StockCall for availability
- Min. Order Qty1
Specification
BIT SIZE: 32
JESD-609 CODE: E0
MANUFACTURER: MOTOROLA SEMICONDUCTOR PRODUCTS
MANUFACTURER PART NUMBER: MC68EC030FE25B
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
PACKAGE BODY MATERIAL: CERAMIC
PACKAGE CODE: QFP
PACKAGE DESCRIPTION: QFP, QFP(UNSPEC)
PACKAGE EQUIVALENCE CODE: QFP(UNSPEC)
PACKAGE STYLE: FLATPACK
POWER SUPPLIES: 5 V
QUALIFICATION STATUS: NOT QUALIFIED
SPEED: 25 MHZ
SUBCATEGORY: MICROPROCESSORS
SUPPLY VOLTAGE-NOM: 5 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FINISH: TIN/LEAD (SN/PB)
TERMINAL FORM: GULL WING
TERMINAL POSITION: QUAD
UPS/UCS/PERIPHERAL ICS TYPE: MICROPROCESSOR, RISC


