MPC8270ZQMIB

Factory Authorized Line

MOTOROLA

Electronic Component

MPC8270ZQMIB

BGA, BGA516,26X26,40
Call for availability MOTOROLA
Mfr Part # MPC8270ZQMIB
Qty in Stock Call for availability
Factory Stock N/A
Minimum Order 1
Packaging PACKAGE BODY MATERIAL:  PLASTIC/EPOXYPACKAGE CODE:  BGAPACKAGE DESCRIPTION:  BGA, BGA516,26X26,40PACKAGE EQUIVALENCE CODE:  BGA516,26X26,40PACKAGE SHAPE:  SQUAREPACKAGE STYLE:  GRID ARRAY
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Availability

  • Qty in StockCall for availability
  • Min. Order Qty1
Specification

JESD-30 CODE:  S-PBGA-B516

MANUFACTURER:  MOTOROLA SEMICONDUCTOR PRODUCTS

MANUFACTURER PART NUMBER:  MPC8270ZQMIB

NUMBER OF TERMINALS:  516

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA, BGA516,26X26,40

PACKAGE EQUIVALENCE CODE:  BGA516,26X26,40

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

POWER SUPPLIES:  1.5,3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  OTHER UPS/UCS/PERIPHERAL ICS

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  BALL

TERMINAL PITCH:  1 MM

TERMINAL POSITION:  BOTTOM