Mfr Part #
MPC8270ZQMIB
Qty in Stock
Call for availability
Factory Stock
N/A
Minimum Order
1
Packaging
PACKAGE BODY MATERIAL: PLASTIC/EPOXYPACKAGE CODE: BGAPACKAGE DESCRIPTION: BGA, BGA516,26X26,40PACKAGE EQUIVALENCE CODE: BGA516,26X26,40PACKAGE SHAPE: SQUAREPACKAGE STYLE: GRID ARRAY
Availability
- Qty in StockCall for availability
- Min. Order Qty1
Specification
JESD-30 CODE: S-PBGA-B516
MANUFACTURER: MOTOROLA SEMICONDUCTOR PRODUCTS
MANUFACTURER PART NUMBER: MPC8270ZQMIB
NUMBER OF TERMINALS: 516
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA516,26X26,40
PACKAGE EQUIVALENCE CODE: BGA516,26X26,40
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
POWER SUPPLIES: 1.5,3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SUBCATEGORY: OTHER UPS/UCS/PERIPHERAL ICS
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FORM: BALL
TERMINAL PITCH: 1 MM
TERMINAL POSITION: BOTTOM


