ADDRESS BUS WIDTH:  26

BIT SIZE:  32

BOUNDARY SCAN:  YES

CLOCK FREQUENCY-MAX:  5 MHZ

EXTERNAL DATA BUS WIDTH:  32

FORMAT:  FIXED POINT

INTEGRATED CACHE:  YES

JESD-30 CODE:  S-PBGA-B256

LENGTH:  23 MM

LOW POWER MODE:  YES

MANUFACTURER:  MOTOROLA SEMICONDUCTOR PRODUCTS

MANUFACTURER PART NUMBER:  XPC823ECZT66B2

NUMBER OF TERMINALS:  256

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.35 MM

SPEED:  66 MHZ

SUPPLY VOLTAGE-MAX:  3.6 V

SUPPLY VOLTAGE-MIN:  3 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

WIDTH:  23 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR, RISC