JESD-30 CODE:  S-PBGA-B357

JESD-609 CODE:  E0

MANUFACTURER:  MOTOROLA SEMICONDUCTOR PRODUCTS

MANUFACTURER PART NUMBER:  XPC860MHZP50C1

NUMBER OF TERMINALS:  357

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA, BGA357,19X19,50

PACKAGE EQUIVALENCE CODE:  BGA357,19X19,50

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

POWER SUPPLIES:  3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  OTHER MICROPROCESSOR ICS

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM