XPC860PZP50D3

Factory Authorized Line

MOTOROLA

Electronic Component

XPC860PZP50D3

BGA
Call for availability MOTOROLA
Mfr Part # XPC860PZP50D3
Qty in Stock Call for availability
Factory Stock N/A
Minimum Order 1
Packaging PACKAGE BODY MATERIAL:  PLASTIC/EPOXYPACKAGE CODE:  BGAPACKAGE DESCRIPTION:  BGA,PACKAGE SHAPE:  SQUAREPACKAGE STYLE:  GRID ARRAYPART PACKAGE CODE:  BGA
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Availability

  • Qty in StockCall for availability
  • Min. Order Qty1
Specification

ADDRESS BUS WIDTH:  32

BIT SIZE:  32

BOUNDARY SCAN:  YES

CLOCK FREQUENCY-MAX:  50 MHZ

EXTERNAL DATA BUS WIDTH:  32

FORMAT:  FIXED POINT

INTEGRATED CACHE:  YES

JESD-30 CODE:  S-PBGA-B357

LENGTH:  25 MM

LOW POWER MODE:  YES

MANUFACTURER:  MOTOROLA MOBILITY LLC

MANUFACTURER PART NUMBER:  XPC860PZP50D3

NUMBER OF TERMINALS:  357

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

PIN COUNT:  357

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.05 MM

SPEED:  50 MHZ

SUPPLY VOLTAGE-MAX:  3.465 V

SUPPLY VOLTAGE-MIN:  3.135 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

WIDTH:  25 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR, RISC