ADDITIONAL INTERFACES:  HDLC/SDLC, I²C, IRDA, PCMCIA, SPI, TDM, UART/USART

CATEGORIES:  INTEGRATED CIRCUITS (ICS)

CO-PROCESSORS/DSP:  COMMUNICATIONS; CPM

CORE PROCESSOR:  MPC8XX

ETHERNET:  10 MBPS (4), 10/100 MBPS (1)

EXPANDED DESCRIPTION:  MPC8XX MICROPROCESSOR IC MPC8XX 1 CORE, 32-BIT 80MHZ 357-PBGA (25X25)

GRAPHICS ACCELERATION:  NO

LEAD FREE STATUS / ROHS STATUS:  CONTAINS LEAD / ROHS NON-COMPLIANT

MANUFACTURER:  NXP USA INC.

MANUFACTURER PART NUMBER:  KMPC860TZQ80D4

MOISTURE SENSITIVITY LEVEL (MSL):  3 (168 HOURS)

NUMBER OF CORES/BUS WIDTH:  1 CORE, 32-BIT

OPERATING TEMPERATURE:  0°C ~ 95°C (TA)

PACKAGE / CASE:  357-BBGA

PACKAGING:  TRAY

RAM CONTROLLERS:  DRAM

SERIES:  MPC8XX

SPEED:  80MHZ

STANDARD PACKAGE:  2

SUPPLIER DEVICE PACKAGE:  357-PBGA (25X25)

VOLTAGE - I/O:  3.3V

ALTERNATE PARTS:  MPC860TZQ80D4