ADDRESS BUS WIDTH:  26

BIT SIZE:  32

BOUNDARY SCAN:  YES

CLOCK FREQUENCY-MAX:  27 MHZ

EXTERNAL DATA BUS WIDTH:  32

FORMAT:  FLOATING POINT

INTEGRATED CACHE:  YES

JESD-30 CODE:  S-PBGA-B529

JESD-609 CODE:  E2

LENGTH:  19 MM

LOW POWER MODE:  YES

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  MCIMX536AVV8CR2

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF TERMINALS:  529

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HBGA

PACKAGE DESCRIPTION:  HBGA, BGA529,23X23,32

PACKAGE EQUIVALENCE CODE:  BGA529,23X23,32

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, HEAT SINK/SLUG

PEAK REFLOW TEMPERATURE (CEL):  260

POWER SUPPLIES:  1.1,1.3,1.8/3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.85 MM

SPEED:  800 MHZ

SUBCATEGORY:  GRAPHICS PROCESSORS

SUPPLY CURRENT-MAX:  1.45 A

SUPPLY VOLTAGE-MAX:  1.15 V

SUPPLY VOLTAGE-MIN:  1.05 V

SUPPLY VOLTAGE-NOM:  1.1 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  AUTOMOTIVE

TERMINAL FINISH:  TIN/SILVER (SN/AG)

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  40

WIDTH:  19 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR, RISC