ADDITIONAL INTERFACES:  CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART

CATEGORIES:  INTEGRATED CIRCUITS (ICS)

CO-PROCESSORS/DSP:  MULTIMEDIA; NEON? SIMD

CORE PROCESSOR:  ARM® CORTEX®-A9

DETAILED DESCRIPTION:  ARM® CORTEX®-A9 MICROPROCESSOR IC I.MX6DP 2 CORE, 32-BIT 1.0GHZ 624-FCBGA (21X21)

DISPLAY & INTERFACE CONTROLLERS:  HDMI, KEYPAD, LCD, LVDS, MIPI/DSI, PARALLEL

ETHERNET:  10/100/1000 MBPS (1)

GRAPHICS ACCELERATION:  YES

LEAD FREE STATUS / ROHS STATUS:  LEAD FREE / ROHS COMPLIANT

MANUFACTURER:  NXP USA INC.

MANUFACTURER PART NUMBER:  MCIMX6DP5EYM1AA

MANUFACTURER STANDARD LEAD TIME:  15 WEEKS

MOISTURE SENSITIVITY LEVEL (MSL):  3 (168 HOURS)

NUMBER OF CORES/BUS WIDTH:  2 CORE, 32-BIT

OPERATING TEMPERATURE:  -20°C ~ 105°C (TJ)

PACKAGE / CASE:  624-LFBGA, FCBGA

PACKAGING:  TRAY

RAM CONTROLLERS:  LPDDR2, DDR3L, DDR3

SATA:  SATA 3GBPS (1)

SECURITY FEATURES:  ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS

SERIES:  I.MX6DP

SPEED:  1.0GHZ

STANDARD PACKAGE:  60

SUPPLIER DEVICE PACKAGE:  624-FCBGA (21X21)

USB:  USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)

VOLTAGE - I/O:  1.8V, 2.5V, 2.8V, 3.3V

ALTERNATE PARTS:  MCIMX6DP5EYM1AB