BIT SIZE:  32

BOUNDARY SCAN:  YES

CLOCK FREQUENCY-MAX:  66.67 MHZ

FORMAT:  FLOATING POINT

INTEGRATED CACHE:  YES

JESD-30 CODE:  S-PBGA-B516

JESD-609 CODE:  E2

LENGTH:  27 MM

LOW POWER MODE:  YES

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  MPC8313VRADDC

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF TERMINALS:  516

OPERATING TEMPERATURE-MAX:  105 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA, BGA516,26X26,40

PACKAGE EQUIVALENCE CODE:  BGA516,26X26,40

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PEAK REFLOW TEMPERATURE (CEL):  260

POWER SUPPLIES:  1,1.8/2.5,3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.55 MM

SPEED:  266 MHZ

SUBCATEGORY:  MICROPROCESSORS

SUPPLY VOLTAGE-MAX:  1.05 V

SUPPLY VOLTAGE-MIN:  950 MV

SUPPLY VOLTAGE-NOM:  1 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  OTHER

TERMINAL FINISH:  TIN COPPER/TIN SILVER

TERMINAL FORM:  BALL

TERMINAL PITCH:  1 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  40

WIDTH:  27 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR, RISC