ADDITIONAL INTERFACES:  HDLC/SDLC, I²C, IRDA, PCMCIA, SPI, TDM, UART/USART

BASE PART NUMBER:  MPC875

CATEGORIES:  INTEGRATED CIRCUITS (ICS)

CO-PROCESSORS/DSP:  COMMUNICATIONS; CPM, SECURITY; SEC

CORE PROCESSOR:  MPC8XX

DETAILED DESCRIPTION:  MPC8XX MICROPROCESSOR IC MPC8XX 1 CORE, 32-BIT 133MHZ 256-PBGA (23X23)

ETHERNET:  10 MBPS (1), 10/100 MBPS (2)

GRAPHICS ACCELERATION:  NO

LEAD FREE STATUS / ROHS STATUS:  LEAD FREE / ROHS COMPLIANT

MANUFACTURER:  NXP USA INC.

MANUFACTURER PART NUMBER:  MPC875VR133

MANUFACTURER STANDARD LEAD TIME:  12 WEEKS

MOISTURE SENSITIVITY LEVEL (MSL):  3 (168 HOURS)

NUMBER OF CORES/BUS WIDTH:  1 CORE, 32-BIT

OPERATING TEMPERATURE:  0°C ~ 95°C (TA)

PACKAGE / CASE:  256-BBGA

PACKAGING:  TRAY

RAM CONTROLLERS:  DRAM

SECURITY FEATURES:  CRYPTOGRAPHY

SERIES:  MPC8XX

SPEED:  133MHZ

STANDARD PACKAGE:  300

SUPPLIER DEVICE PACKAGE:  256-PBGA (23X23)

USB:  USB 2.0 (1)

VOLTAGE - I/O:  3.3V