ADDRESS BUS WIDTH:  0

BOUNDARY SCAN:  YES

EXTERNAL DATA BUS WIDTH:  0

FORMAT:  FIXED POINT

INTEGRATED CACHE:  YES

JESD-30 CODE:  R-PBGA-B500

LENGTH:  17 MM

LOW POWER MODE:  YES

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  MSCMMX6QZDK08AB

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF TERMINALS:  500

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  FBGA

PACKAGE DESCRIPTION:  14 X 17 MM, 1.685 MM HEIGHT, 0.65 MM PITCH, BGA-500

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, FINE PITCH

SEATED HEIGHT-MAX:  1.8 MM

SPEED:  800 MHZ

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  OTHER

TERMINAL FORM:  BALL

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  BOTTOM

WIDTH:  14 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR, RISC