BIT SIZE:  8

JESD-30 CODE:  R-XDIP-T50

JESD-609 CODE:  E0

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  N8X300I

NUMBER OF TERMINALS:  50

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  CERAMIC

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP50,.9

PACKAGE EQUIVALENCE CODE:  DIP50,.9

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  MICROPROCESSORS

SURFACE MOUNT:  NO

TECHNOLOGY:  TTL

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR, RISC