BIT SIZE:  32

BOUNDARY SCAN:  YES

FORMAT:  FIXED POINT

INTEGRATED CACHE:  YES

JESD-30 CODE:  S-PBGA-B256

LOW POWER MODE:  YES

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  XPC823ZT75A

NUMBER OF TERMINALS:  256

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

SPEED:  75 MHZ

SUPPLY VOLTAGE-NOM:  2.5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  BALL

TERMINAL POSITION:  BOTTOM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR