ADDRESS BUS WIDTH:  26

BIT SIZE:  32

BOUNDARY SCAN:  YES

CLOCK FREQUENCY-MAX:  34 MHZ

EXTERNAL DATA BUS WIDTH:  32

FORMAT:  FLOATING POINT

INTEGRATED CACHE:  YES

JESD-30 CODE:  S-PBGA-B256

JESD-609 CODE:  E1

LENGTH:  27 MM

LOW POWER MODE:  YES

MANUFACTURER:  RENESAS ELECTRONICS CORPORATION

MANUFACTURER PART NUMBER:  HD6417751RBP200V

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF TERMINALS:  256

OPERATING TEMPERATURE-MAX:  75 °C

OPERATING TEMPERATURE-MIN:  -20 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  256

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.1 MM

SPEED:  200 MHZ

SUPPLY VOLTAGE-MAX:  1.6 V

SUPPLY VOLTAGE-MIN:  1.35 V

SUPPLY VOLTAGE-NOM:  1.5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL EXTENDED

TERMINAL FINISH:  TIN SILVER COPPER

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  20

WIDTH:  27 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR, RISC