BIT SIZE:  32

JESD-30 CODE:  S-PQFP-G160

MANUFACTURER:  SAMSUNG SEMICONDUCTOR

MANUFACTURER PART NUMBER:  S3C44B0X01-ED80

NUMBER OF TERMINALS:  160

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QFP

PACKAGE DESCRIPTION:  QFP, QFP160,1.0SQ,20

PACKAGE EQUIVALENCE CODE:  QFP160,1.0SQ,20

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK

POWER SUPPLIES:  2.5,3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SPEED:  66 MHZ

SUBCATEGORY:  MICROPROCESSORS

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  QUAD

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR, RISC