Mfr Part #
S3C4510B01-QE80
Qty in Stock
Call for availability
Factory Stock
N/A
Minimum Order
1
Packaging
PACKAGE BODY MATERIAL: PLASTIC/EPOXYPACKAGE CODE: QFPPACKAGE DESCRIPTION: QFP, QFP208,1.2SQ,20PACKAGE EQUIVALENCE CODE: QFP208,1.2SQ,20PACKAGE SHAPE: SQUAREPACKAGE STYLE: FLATPACK
Availability
- Qty in StockCall for availability
- Min. Order Qty1
Specification
JESD-30 CODE: S-PQFP-G208
MANUFACTURER: SAMSUNG SEMICONDUCTOR
MANUFACTURER PART NUMBER: S3C4510B01-QE80
NUMBER OF TERMINALS: 208
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: QFP
PACKAGE DESCRIPTION: QFP, QFP208,1.2SQ,20
PACKAGE EQUIVALENCE CODE: QFP208,1.2SQ,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK
POWER SUPPLIES: 3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SUBCATEGORY: OTHER MICROPROCESSOR ICS
SUPPLY CURRENT-MAX: 230 MA
SUPPLY VOLTAGE-NOM: 3.3 V
SURFACE MOUNT: YES
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FORM: GULL WING
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: QUAD



