JESD-30 CODE:  S-PQFP-G80

MANUFACTURER:  WINBOND ELECTRONICS CORP

MANUFACTURER PART NUMBER:  W83L950D

NUMBER OF TERMINALS:  80

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QFP

PACKAGE DESCRIPTION:  QFP, QFP80,.55SQ,20

PACKAGE EQUIVALENCE CODE:  QFP80,.55SQ,20

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK

POWER SUPPLIES:  3.3/5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  OTHER MICROPROCESSOR ICS

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  QUAD

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR CIRCUIT